The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2009
Filed:
Nov. 22, 2006
Applicant:
Jau-shoung Chen, Hsinchu County, TW;
Inventor:
Jau-Shoung Chen, Hsinchu County, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kao-Hsiung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01);
U.S. Cl.
CPC ...
Abstract
A flip-chip package structure with stiffener includes a substrate, a first stiffener positioned on a surface of the substrate, a chip having a plurality of bumps adopted to electrically connect the substrate and the chip, and a second stiffener positioned on the surface of the substrate and connected with the first stiffener. The first stiffener is positioned outside of the second stiffener.