The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2009
Filed:
Sep. 07, 2005
Kenichi Oohori, Shimodate, JP;
Yoshihiro Nakamura, Shimodate, JP;
Hikari Murai, Yuki, JP;
Yoshiyuki Takeda, Shimodate, JP;
Yasuyuki Hirai, Oyama, JP;
Shinichi Kamoshida, Shimodate, JP;
Minoru Kakitani, Shimodate, JP;
Norihiro Abe, Shimodate, JP;
Syunichi Numata, Hitachi, JP;
Teruki Aizawa, Utsunomiya, JP;
Ken Nanaumi, Shimodate, JP;
Kenichi Oohori, Shimodate, JP;
Yoshihiro Nakamura, Shimodate, JP;
Hikari Murai, Yuki, JP;
Yoshiyuki Takeda, Shimodate, JP;
Yasuyuki Hirai, Oyama, JP;
Shinichi Kamoshida, Shimodate, JP;
Minoru Kakitani, Shimodate, JP;
Norihiro Abe, Shimodate, JP;
Syunichi Numata, Hitachi, JP;
Teruki Aizawa, Utsunomiya, JP;
Ken Nanaumi, Shimodate, JP;
Hitachi Chemical Company, Ltd, Tokyo, JP;
Abstract
The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.