The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2009

Filed:

Oct. 03, 2006
Applicants:

Nien-tien Cheng, Tu-Cheng, TW;

Chen-shen Lin, Tu-Cheng, TW;

Inventors:

Nien-Tien Cheng, Tu-Cheng, TW;

Chen-Shen Lin, Tu-Cheng, TW;

Assignee:

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/02 (2006.01); F28F 7/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipation apparatus () includes a computer enclosure () made of thermally conductive material, a fin assembly () secured to the computer enclosure, and a heat pipe () having an evaporating section () thermally connecting with a heat generating electronic component and a condensing section () thermally connecting with the fin assembly. The fin assembly has a bottom surface contacting with a chassis of the enclosure to thereby transfer heat from the fin assembly to the chassis for dissipation. The enclosure forms a pair of clamping members () clamping the fin assembly therebetween.


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