The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7530163 B1

PDF
Full Text
Expired
Date of Patent:
May. 12, 2009

Filed:

Nov. 23, 2005
Applicants:

Masahiro Sunohara, Nagano, JP;

Kei Murayama, Nagano, JP;

Naohiro Mashino, Nagano, JP;

Mitsutoshi Higashi, Nagano, JP;

Inventors:

Masahiro Sunohara, Nagano, JP;

Kei Murayama, Nagano, JP;

Naohiro Mashino, Nagano, JP;

Mitsutoshi Higashi, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided a electronic parts packaging structure that includes a mounted body on which an electronic parts is mounted, the electronic parts having a connection pad, which has an etching stopper film (a copper film, a gold film, a silver film, or a conductive past film) as an uppermost film, and mounted on the mounted body to direct the connection pad upward, an interlayer insulating film for covering the electronic parts, a via hole formed in the insulating film on the connection pad of the electronic parts, and a wiring pattern connected to the connection pad via the via hole.


Find Patent Forward Citations

Sunohara, Masahiro. (2009). Electronic parts packaging structure and method of manufacturing the same (U.S. Patent No. 7530163). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7530163

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