The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2009
Filed:
Jun. 08, 2005
Ming-hung Chen, Hsinchu, TW;
Shih-yi Wen, Hsinchu, TW;
Wu-cheng Kuo, Hsinchu, TW;
Bing-ru Chen, Hsinchu, TW;
Jui-ping Weng, Hsinchu, TW;
Hsiao-wen Lee, Hsinchu, TW;
Ming-Hung Chen, Hsinchu, TW;
Shih-Yi Wen, Hsinchu, TW;
Wu-Cheng Kuo, Hsinchu, TW;
Bing-Ru Chen, Hsinchu, TW;
Jui-Ping Weng, Hsinchu, TW;
Hsiao-Wen Lee, Hsinchu, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.