The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2009
Filed:
Aug. 16, 2007
Gregory P. Muldowney, Earleville, MD (US);
Gregory P. Muldowney, Earleville, MD (US);
Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US);
Abstract
The polishing pad () is useful for polishing at least one of a magnetic, optical and semiconductor substrate () in the presence of a polishing medium (). The polishing padincludes multiple layers of polishing filaments () stacked on a base layer () of polishing filaments, the multiple layers of polishing filaments () having a sequential stacked formation with each layer of the polishing filaments being above and attached to a lower polishing filament, the multiple layers of polishing filaments () being parallel to a polishing surface of the polishing pad () and wherein individual polishing filaments () of the multiple layers of polishing filaments () are above an average of at least three polishing filaments (), to form the polishing pad having an open lattice structure of interconnected polishing filaments ().