The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2009

Filed:

Aug. 31, 2006
Applicants:

Michael Leddige, Beaverton, OR (US);

James A. Mccall, Hillsboro, OR (US);

Inventors:

Michael Leddige, Beaverton, OR (US);

James A. McCall, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit interconnection system is disclosed. The system can include a first integrated circuit die having a first electrode configuration and a second integrated die having the same or a substantially similar electrode configuration. The system can also include a multilayer flexible cable having a first side and a second side that has substantially parallel conductors running along the cable. At least a portion of one of the parallel conductors can be exposed on the first side and/or the second side, such that the first and second integrated circuit die can be connected to both the first side and the second side of the multilayer flexible cable. The cable can be folded to provide a dense interconnect for stacked memory configurations.


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