The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2009
Filed:
Jul. 16, 2005
Deyan Wang, Hudson, MA (US);
Robert D. Mikkola, Grafton, MA (US);
Chunyi Wu, Shrewsbury, MA (US);
George G. Barclay, Jefferson, MA (US);
Deyan Wang, Hudson, MA (US);
Robert D. Mikkola, Grafton, MA (US);
Chunyi Wu, Shrewsbury, MA (US);
George G. Barclay, Jefferson, MA (US);
Rohm and Haas Electronic Materials LLC, Marlborough, MA (US);
Abstract
Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is substantially planar across a range of electrolyte concentrations. Methods of depositing metal layers using such plating baths are also disclosed. These baths and methods are useful for providing a planar layer of copper on a substrate having small apertures, such as an electronic device.