The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2009
Filed:
Sep. 29, 2006
Yuichi Morita, Gunma, JP;
Shinzo Ishibe, Gunma, JP;
Takashi Noma, Gunma, JP;
Hisao Otsuka, Gunma, JP;
Yukihiro Takao, Gunma, JP;
Hiroshi Kanamori, Tokyo, JP;
Yuichi Morita, Gunma, JP;
Shinzo Ishibe, Gunma, JP;
Takashi Noma, Gunma, JP;
Hisao Otsuka, Gunma, JP;
Yukihiro Takao, Gunma, JP;
Hiroshi Kanamori, Tokyo, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
The invention prevents a pad electrode for external connection of a semiconductor device from being damaged. An electronic circuit, a first pad electrode connected to the electronic circuit, and a second pad electrode connected to the first pad electrode are formed on a semiconductor substrate. A first protection film is formed, covering the first pad electrode and having an opening on the second pad electrode only. A wiring layer is further formed, being connected to the back surface of the first pad electrode through a via hole penetrating the semiconductor substrate and extending from the via hole onto the back surface of the semiconductor substrate.