The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2009
Filed:
Jun. 19, 2007
Applicants:
Tsutomu Sato, Yokohama, JP;
Mie Matsuo, Kamakura, JP;
Ichiro Mizushima, Yokohama, JP;
Yoshitaka Tsunashima, Yokohama, JP;
Shinichi Takagi, Yokohama, JP;
Inventors:
Tsutomu Sato, Yokohama, JP;
Mie Matsuo, Kamakura, JP;
Ichiro Mizushima, Yokohama, JP;
Yoshitaka Tsunashima, Yokohama, JP;
Shinichi Takagi, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/764 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
To change a plurality of trenches to one flat empty space by two-dimensionally forming the trenches on the surface of a semiconductor substrate and then applying heat treatment to the semiconductor substrate.