The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7504018 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 17, 2009

Filed:

Oct. 31, 2006
Applicants:

You Wang, Cupertino, CA (US);

Stan D. Tsai, Fremont, CA (US);

Lakshmanan Karuppiah, San Jose, CA (US);

Jie Diao, San Jose, CA (US);

Renhe Jia, Berkeley, CA (US);

Alpay Yilmaz, San Jose, CA (US);

Inventors:

You Wang, Cupertino, CA (US);

Stan D. Tsai, Fremont, CA (US);

Lakshmanan Karuppiah, San Jose, CA (US);

Jie Diao, San Jose, CA (US);

Renhe Jia, Berkeley, CA (US);

Alpay Yilmaz, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25F 7/00 (2006.01); C25F 3/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.


Find Patent Forward Citations

Wang, You. (2009). Electrochemical method for ecmp polishing pad conditioning (U.S. Patent No. 7504018). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7504018

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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