The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2009
Filed:
Mar. 24, 2004
Applicants:
Francis J. Kelley, Bear, DE (US);
John Quanci, Haddonfield, NJ (US);
Hongyu Wang, Wilmington, DE (US);
Inventors:
Francis J. Kelley, Bear, DE (US);
John Quanci, Haddonfield, NJ (US);
Hongyu Wang, Wilmington, DE (US);
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention provides an aqueous composition useful for polishing copper interconnects on a semiconductor wafer comprising by weight percent up to 25 oxidizer, 0.05 to 1 inhibitor for a nonferrous metal, 0.01 to 5 complexing agent for the nonferrous metal, 0.01 to 5 modified cellulose, and balance water, wherein the composition is free of polyacrylic acid, the amount of modified cellulose providing a copper removal function and a wafer clear of copper.