The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2009
Filed:
Feb. 17, 2006
Applicants:
Teruhisa Ikuta, Nara, JP;
Hiroyoshi Ogura, Kyoto, JP;
Yoshinobu Sato, Toyama, JP;
Toru Terashita, Toyama, JP;
Hisao Ichijo, Kyoto, JP;
Inventors:
Teruhisa Ikuta, Nara, JP;
Hiroyoshi Ogura, Kyoto, JP;
Yoshinobu Sato, Toyama, JP;
Toru Terashita, Toyama, JP;
Hisao Ichijo, Kyoto, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided is a semiconductor device which includes a conductive bonding pad formed on a semiconductor substrate of the first conduction type via an insulating film and a diffusion layer of the second conduction type formed on a surface of the semiconductor substrate under the bonding pad. Characteristics do not deteriorate even when a breakdown occurs during wire bonding.