The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2009

Filed:

Feb. 25, 2003
Applicants:

Masanori Kaneko, Tokyo, JP;

Hiroyuki Hama, Tokyo, JP;

Takaji Ishikawa, Tokyo, JP;

Shigeru Matsumura, Tokyo, JP;

Inventors:

Masanori Kaneko, Tokyo, JP;

Hiroyuki Hama, Tokyo, JP;

Takaji Ishikawa, Tokyo, JP;

Shigeru Matsumura, Tokyo, JP;

Assignee:

Advantest Corp., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B25B 27/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system for mating and demating a plurality of connectors mounted on a socket board with and from a plurality of corresponding connectors mounted on a motherboard includes: an adapter that is arranged above a surface opposite to the socket board surface on which the connectors are arranged and is movable in a direction in which the connectors are mated and demated; pressing means which contacts the surface of the socket board on which the semiconductor components are placed to press the socket board to the motherboard by lowering the adapter; and pulling means each of which engages with an engaging hole formed in the socket board and pulls the socket board in the direction in which the socket board is separated from the motherboard by lifting the adapter.


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