The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2009
Filed:
Apr. 29, 2008
Julien Sylvestre, Chambly, CA;
Jean Audet, Granby, CA;
Marco Gauvin, Granby, CA;
Sylvain Pharand, St-Bruno, CA;
Julien Sylvestre, Chambly, CA;
Jean Audet, Granby, CA;
Marco Gauvin, Granby, CA;
Sylvain Pharand, St-Bruno, CA;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for analyzing the warpage of organic laminates used in flip chip packages includes collecting warpage data and layer thickness data for several laminates. A principal components analysis may then be performed on the thickness data to calculate orthogonal basis vectors to re-express the thickness data in a different basis. The thickness data may then be projected onto the orthogonal basis vectors. A linear model may be generated that expresses the warpage data for each laminate in terms of the projection of corresponding thickness data onto the orthogonal basis vectors, each projection multiplied by a weight. These weights may then be analyzed to determine the contribution of each orthogonal basis vector to the variance of the warpage data. The contribution and structure of each orthogonal basis vector may then be interpreted to estimate the importance of each layer or combination of layers in contributing to the laminate warpage.