The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2009
Filed:
Jun. 30, 2004
Hsien-ping Feng, Yonghe, TW;
Ming-yuang Cheng, Taipei, TW;
Si-kwua Cheng, Hsinchu, TW;
Steven Lin, Hsih-Chu, TW;
Jung-chih Tsao, Taipei, TW;
Chen-peng Fan, Sinfong Township, Hsinchu County, TW;
Chi-wen Liu, Hsinchu, TW;
Hsien-Ping Feng, Yonghe, TW;
Ming-Yuang Cheng, Taipei, TW;
Si-Kwua Cheng, Hsinchu, TW;
Steven Lin, Hsih-Chu, TW;
Jung-Chih Tsao, Taipei, TW;
Chen-Peng Fan, Sinfong Township, Hsinchu County, TW;
Chi-Wen Liu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A method of stabilizing plating film impurities in an electrochemical plating bath solution is disclosed. The method includes providing an electrochemical plating machine in which an electrochemical plating process is carried out. A by-product bath solution is formed by continually removing a pre-filtered bath solution from the machine and removing an additive from the pre-filtered bath solution. A clean bath solution is formed by removing an additive by-product from the by-product bath solution. An additive bath solution is formed by adding a fresh additive to the clean bath solution. The additive bath solution is added to the electrochemical plating machine. An apparatus for stabilizing film impurities in an electrochemical plating bath solution is also disclosed.