The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2009

Filed:

Apr. 20, 2007
Applicants:

Douglas D. Coolbaugh, Highland, NY (US);

Zhong-xiang He, Essex Junction, VT (US);

Robert M. Rassel, Colchester, VT (US);

Richard J. Rassel, Colchester, VT (US);

Stephen A. St Onge, Colchester, VT (US);

Inventors:

Douglas D. Coolbaugh, Highland, NY (US);

Zhong-Xiang He, Essex Junction, VT (US);

Robert M. Rassel, Colchester, VT (US);

Richard J. Rassel, Colchester, VT (US);

Stephen A. St Onge, Colchester, VT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/8244 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor-insulator-silicide (SIS) capacitor is formed by depositing a thin silicon containing layer on a salicide mask dielectric layer, followed by lithographic patterning of the stack and metallization of the thin silicon containing layer and other exposed semiconductor portions of a semiconductor substrate. The thin silicon containing layer is fully reacted during metallization and consequently converted to a silicide alloy layer, which is a first electrode of a capacitor. The salicide mask dielectric layer is the capacitor dielectric. The second electrode of the capacitor may be a doped polycrystalline silicon containing layer, a doped single crystalline semiconductor region, or another doped polycrystalline silicon containing layer disposed on the doped polycrystalline silicon containing layer. The SIS insulator may further comprise other dielectric layers and conductive layers to increase capacitance per area.


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