The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2009
Filed:
Oct. 12, 2006
Brian Samuel Beaman, Apex, NC (US);
Joseph Kuczynski, Rochester, MN (US);
Theron Lee Lewis, Rochester, MN (US);
Amanda Elisa Ennis Mikhail, Rochester, MN (US);
Arvind Kumar Sinha, Rochester, MN (US);
Brian Samuel Beaman, Apex, NC (US);
Joseph Kuczynski, Rochester, MN (US);
Theron Lee Lewis, Rochester, MN (US);
Amanda Elisa Ennis Mikhail, Rochester, MN (US);
Arvind Kumar Sinha, Rochester, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The illustrative embodiments provide a method for manufacturing a socket and attaching the socket to a printed circuit board. Surface mounted contacts for a bottom surface of a socket are provided. The surface mounted contacts are a plurality of conductive metal pads that directly attach to surface connections on a printed circuit board. An elongated housing is formed comprising at least two members that are coupled together and disposed to form an aperture in between the at least two members. At least one dimension of the at least two members is selected to compensate for a difference between coefficients of thermal expansion between the socket and the printed circuit board. The at least two members and the surface mounted contacts are aligned with the printed circuit board using a clip. In response to completing a solder reflow process, the clip is removed and a module is inserted into the aperture.