The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2008
Filed:
May. 17, 2006
Wen-chieh Lee, Science-Based Industrial Park Hsinchu, TW;
Mou-shiung Lin, Science-Based Industrial Park Hsinchu, TW;
Chien-kang Chou, Science-Based Industrial Park Hsinchu, TW;
Yi-cheng Liu, Science-Based Industrial Park Hsinchu, TW;
Chiu-ming Chou, Science-Based Industrial Park Hsinchu, TW;
Jin-yuan Lee, Science-Based Industrial Park Hsinchu, TW;
Wen-Chieh Lee, Science-Based Industrial Park Hsinchu, TW;
Mou-Shiung Lin, Science-Based Industrial Park Hsinchu, TW;
Chien-Kang Chou, Science-Based Industrial Park Hsinchu, TW;
Yi-Cheng Liu, Science-Based Industrial Park Hsinchu, TW;
Chiu-Ming Chou, Science-Based Industrial Park Hsinchu, TW;
Jin-Yuan Lee, Science-Based Industrial Park Hsinchu, TW;
Megica Corporation, Hsinchu, TW;
Abstract
A method for fabricating a circuitry component includes providing a semiconductor substrate, a first coil over said semiconductor substrate, a passivation layer over said first coil; and depositing a second coil over said passivation layer and over said first coil. Said second coil may be deposited by forming a first metal layer over said passivation layer, forming a pattern defining layer over said first metal layer, a first opening in said pattern defining layer exposing said first metal layer, forming a second metal layer over said first metal layer exposed by said first opening, removing said pattern defining layer, and removing said first metal layer not under said second metal layer.