The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2008

Filed:

Jun. 30, 2004
Applicants:

Meng Ding, Mountain View, CA (US);

Kuok San Ho, Santa Clara, CA (US);

Tsann Lin, Saratoga, CA (US);

Huey-ming Tzeng, San Jose, CA (US);

Inventors:

Meng Ding, Mountain View, CA (US);

Kuok San Ho, Santa Clara, CA (US);

Tsann Lin, Saratoga, CA (US);

Huey-Ming Tzeng, San Jose, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/187 (2006.01);
U.S. Cl.
CPC ...
Abstract

One illustrative method of fabricating a read sensor of a magnetic head includes the steps of forming a plurality of read sensor layers on a wafer; etching the read sensor layers to form a read sensor structure with a trench in front of the read sensor structure; forming a highly porous material within the trench; and slicing the wafer and lapping the sliced wafer through the highly porous material until an air bearing surface (ABS) of the magnetic head is reached. Advantageously, the highly porous material in front of the read sensor structure reduces mechanical stress on the read sensor during the lapping process. This reduces the likelihood that the amplitude of the read sensor will be degraded or set in a 'flipped' or reversed orientation, as well as reduces the likelihood that electrostatic discharge (ESD) damage to the read sensor will occur.


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