The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2008
Filed:
Dec. 13, 2005
Applicants:
Ikuo Itakura, Fukuoka, JP;
Syouichiro Himuro, Fukuoka, JP;
Inventors:
Ikuo Itakura, Fukuoka, JP;
Syouichiro Himuro, Fukuoka, JP;
Assignee:
Toto Ltd., Fukuoka, JP;
Primary Examiner:
Int. Cl.
CPC ...
H02N 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
The object of the present invention is to provide an electrostatic chuck which has high plasma resistance and high capability of cooling a material to be clamped. As for the basic structure of the electrostatic chuck, an insulating film is formed on a surface of a metal plate by flame spraying, and a dielectric substrate is bonded onto the insulating film by an insulating adhesive layer. The top surface of the dielectric substrate is a surface for mounting a material to be clamped W such as a semiconductor wafer. Electrodes are formed on the lower surface of the dielectric substrate.