The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2008
Filed:
May. 10, 2006
Applicants:
Cheng-qun Gui, Best, NL;
David Christopher Ockwell, Waalre, NL;
Gabriel Nicolaas Martinus Maria Van Der Voort, Valkenswaard, NL;
Inventors:
Cheng-Qun Gui, Best, NL;
David Christopher Ockwell, Waalre, NL;
Gabriel Nicolaas Martinus Maria Van Der Voort, Valkenswaard, NL;
Assignee:
ASML Netherlands B.V., Veldhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for locating, forming, or both locating and forming, bumps of material on a substrate having a plurality of devices, the method includes receiving data which indicates the number and location of the devices on the substrate, then using a flip-chip bumping apparatus to locate, form, or both locate and form, bumps of material on the devices, the positions of the devices being determined using the data.