The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2008
Filed:
Oct. 12, 2006
Nien-tien Cheng, Tu-Cheng, TW;
Chen-shen Lin, Tu-Cheng, TW;
Nien-Tien Cheng, Tu-Cheng, TW;
Chen-Shen Lin, Tu-Cheng, TW;
Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;
Abstract
A heat dissipation assembly () is provided. The heat dissipation assembly () comprises a chassis () of an electronic product, a heat sink () having a bottom portion thereof being insert-molded with the chassis () so that the heat sink () and the chassis () are integrally connected together as a single piece, a base () secured to the chassis () and having a top surface () thermally connecting with a heat generating electronic unit of the electronic product and a bottom surface () thermally connecting with the chassis (), a fan () used for cooling the heat sink (), and a heat pipe () having an evaporator section () connected with the base () and a condenser section () connected with the heat sink ().