The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2008
Filed:
May. 28, 2004
Christian R. Bonhote, San Jose, CA (US);
Heather K. Desimone, Morgan Hill, CA (US);
John W. Lam, San Jose, CA (US);
Matthew W. Last, San Jose, CA (US);
Edward Hin Pong Lee, San Jose, CA (US);
Ian R. Mcfadyen, San Jose, CA (US);
Christian R. Bonhote, San Jose, CA (US);
Heather K. DeSimone, Morgan Hill, CA (US);
John W. Lam, San Jose, CA (US);
Matthew W. Last, San Jose, CA (US);
Edward Hin Pong Lee, San Jose, CA (US);
Ian R. McFadyen, San Jose, CA (US);
Hitachi Global Storage Technologies Netherlands B.V., Amsterdam, NL;
Abstract
An electroplated film is deposited over a substrate with a plating frame pattern that includes a plating field defined by a plurality of individual features. By dividing the plating field into a plurality of individual features, the delamination force at any location on the plating field is greatly reduced. Thus, a film with a large stress, such as a high moment film, may be plated to a greater thickness than is possible with conventionally plated films.