The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2008
Filed:
Nov. 09, 2006
Jason Keleher, Aurora, IL (US);
Daniel Woodland, Oswego, IL (US);
Francesco DE Rege Thesauro, Naperville, IL (US);
Robert Medsker, Yorkville, IL (US);
Jason Aggio, Bolingbrook, IL (US);
Jason Keleher, Aurora, IL (US);
Daniel Woodland, Oswego, IL (US);
Francesco De Rege Thesauro, Naperville, IL (US);
Robert Medsker, Yorkville, IL (US);
Jason Aggio, Bolingbrook, IL (US);
Cabot Microelectronics Corporation, Aurora, IL (US);
Abstract
The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing low-k dielectric materials. The composition comprises a particulate abrasive material, at least one silicone-free nonionic surfactant comprising a hydrophilic portion and a lipophilic portion, at least one silicone-containing nonionic surfactant comprising a hydrophilic portion and a lipophilic portion, and an aqueous carrier therefor. A CMP method for polishing a low-k dielectric surface utilizing the composition is also disclosed.