The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2008
Filed:
Aug. 18, 2006
Toyoaki Sakai, Nagano, JP;
Katsuya Fukase, Nagano, JP;
Toyoaki Sakai, Nagano, JP;
Katsuya Fukase, Nagano, JP;
Abstract
A method of forming a high aspect ratio metal plate pattern or circuit board by multi-stage etching with a metal mask is disclosed. A resist () is coated on one or two surfaces of a copper plate () and patterned into a resist pattern. A tin plating layer () is formed using this resist pattern, and with this tin plating layer as a mask, the copper plate is half etched. By coating, exposing and developing the positive resist (), the positive resist under the tin plating layer is protected. With the tin plating layer and the protective resist layer as a mask, the half etching is executed again. This process is repeated until the resist and the tin plating layer used as a masking are finally removed to produce a metal pattern ().