The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2008
Filed:
Jul. 27, 2006
Natalie Barbara Feilchenfeld, Jericho, VT (US);
Zhong-xiang He, Essex Junction, VT (US);
Qizhi Liu, Essex Junction, VT (US);
Bethann Rainey, Williston, VT (US);
Ping-chuan Wang, Hopewell Junction, NY (US);
Kimball M. Watson, Essex Junction, VT (US);
Natalie Barbara Feilchenfeld, Jericho, VT (US);
Zhong-Xiang He, Essex Junction, VT (US);
Qizhi Liu, Essex Junction, VT (US);
BethAnn Rainey, Williston, VT (US);
Ping-Chuan Wang, Hopewell Junction, NY (US);
Kimball M. Watson, Essex Junction, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A semiconductor structure and methods for forming the same. The semiconductor structure includes (a) a substrate; (b) a first semiconductor device on the substrate; (c) N ILD (Inter-Level Dielectric) layers on the first semiconductor device, wherein N is an integer greater than one; and (d) an electrically conductive line electrically coupled to the first semiconductor device. The electrically conductive line is adapted to carry a lateral electric current in a lateral direction parallel to an interfacing surface between two consecutive ILD layers of the N ILD layers. The electrically conductive line is present in at least two ILD layers of the N ILD layers. The electrically conductive line does not comprise an electrically conductive via that is adapted to carry a vertical electric current in a vertical direction perpendicular to the interfacing surface.