The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2008

Filed:

Dec. 27, 2005
Applicants:

Michael J. Nystrom, San Jose, CA (US);

Belgacem Haba, Saratoga, CA (US);

Giles Humpston, Aylesbury, GB;

Inventors:

Michael J. Nystrom, San Jose, CA (US);

Belgacem Haba, Saratoga, CA (US);

Giles Humpston, Aylesbury, GB;

Assignee:

Tessera, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

A compliant structure is provided on a semiconductor wafer. The compliant structure includes cavities. The compliant structure and the wafer seal the cavities during process steps used to form conductive elements on the compliant structure. After processing, vents are opened to connect the cavities to the exterior of the assembly. The vents may be formed by severing the wafer and compliant structure to form individual units, so that the severance planes intersect channels or other voids communicating with the cavities. Alternatively, the vents may be formed by forming holes in the compliant structure, or by opening bores extending through the wafer.


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