The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2008

Filed:

Sep. 21, 2006
Applicants:

Jung-ho Lee, Suwon-si, KR;

Jung-sik Choi, Seongnam-si, KR;

Jun-hyun Cho, Suwon-si, KR;

Youn-joung Cho, Suwon-si, KR;

Tae-sung Kim, Suwon-si, KR;

Mi-ae Kim, Seoul, KR;

Kyoo-chul Cho, Yongin-si, KR;

Inventors:

Jung-Ho Lee, Suwon-si, KR;

Jung-Sik Choi, Seongnam-si, KR;

Jun-Hyun Cho, Suwon-si, KR;

Youn-Joung Cho, Suwon-si, KR;

Tae-Sung Kim, Suwon-si, KR;

Mi-Ae Kim, Seoul, KR;

Kyoo-Chul Cho, Yongin-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeoggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01); C23C 16/06 (2006.01); B05D 7/22 (2006.01); H05H 1/24 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method of manufacturing a metal wiring, an organic aluminum precursor that includes aluminum as a central metal is applied to a substrate. The organic aluminum precursor applied to the substrate is thermally decomposed to form aluminum. The aluminum is deposited on the substrate to form an aluminum wiring having a low resistance. The organic aluminum precursor includes a chemical structure in accordance with one of the chemical formulae:


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