The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2008
Filed:
Mar. 08, 2005
Chen-chung Du, Hsinchu, TW;
Jen-rong Huang, Hsinchu, TW;
Pang-ming Chiang, Taipei, TW;
Chih-yuan Tseng, Hsinchu, TW;
Muh-wang Liang, Miaoli Hsien, TW;
Chih-cheng Wang, Hsinchu Hsien, TW;
Yi-chao Weng, Hsinchu Hsien, TW;
Chen-Chung Du, Hsinchu, TW;
Jen-Rong Huang, Hsinchu, TW;
Pang-Ming Chiang, Taipei, TW;
Chih-Yuan Tseng, Hsinchu, TW;
Muh-Wang Liang, Miaoli Hsien, TW;
Chih-Cheng Wang, Hsinchu Hsien, TW;
Yi-Chao Weng, Hsinchu Hsien, TW;
Industrial Technology Research Institute, Hsinchu Hsien, TW;
Abstract
A wafer electroplating apparatus with a function of bubble removal includes an electroplating bath main body and a fixing device. The electroplating bath main body has an inlet device, a first de-bubble tank and at least an air hole. The fixing device has a second de-bubble tank and an outer shell. The air hole guides gathering bubbles to an outside of the electroplating bath main body so as to remove bubbles. The fixing device can be put into the first de-bubble tank within the electroplating bath main body to form a de-bubble area and is separated easily therefrom to clean the wafer electroplating apparatus. The electroplating bath main body further includes a baffle for rectifying electroplating solution flow before entering the inlet device.