The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2008
Filed:
Jan. 20, 2006
David F. Abdo, Scottsdale, AZ (US);
Alexander J. Elliott, Tempe, AZ (US);
Lakshminarayan Viswanathan, Phoenix, AZ (US);
David F. Abdo, Scottsdale, AZ (US);
Alexander J. Elliott, Tempe, AZ (US);
Lakshminarayan Viswanathan, Phoenix, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A method of packaging a semiconductor die includes the steps of providing a flange (), coupling one or more active die () to the flange with a lead-free die attach material (), staking a leadframe () to the flange after coupling the one or more active die to the flange, electrically interconnecting the one or more active die and the leadframe with an interconnect structure (), and applying a plastic material () over the flange, the one or more active die, the leadframe, and the interconnect structure.