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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7442879 B1

PDFFull Text
Date of Patent:
Oct. 28, 2008

Filed:

Oct. 06, 2005

Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate

Applicants:

Rabindra N. Das, Ithaca, NY (US);

John M. Lauffer, Waverly, NY (US);

Roy H. Magnuson, Endicott, NY (US);

Voya R. Markovich, Endwell, NY (US);

Inventors:

Rabindra N. Das, Ithaca, NY (US);

John M. Lauffer, Waverly, NY (US);

Roy H. Magnuson, Endicott, NY (US);

Voya R. Markovich, Endwell, NY (US);

Assignee:

Endicott Interconect Technologies, Inc., Endicott, NY (US);

Attorneys:

Hinman, Howard & Kattell

Mark Levy

Lawrence R. Fraley

Primary Examiner:

Jeremy C Norris

Int. Cl.
CPC ...
H01R 12/04 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a binder component and at least one metallic component including microparticles. In another embodiment, the paste includes the binder and a plurality of nano-wires. Selected ones of the microparticles or nano-wires include a layer of solder thereon. A method of making such a substrate is also provided, as are an electrical assembly and information handling system adapter for having such a substrate as part thereof.

Find Patent Forward Citations

Das, Rabindra. (2008). Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate (U.S. Patent No. 7442879). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7442879

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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