The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2008

Filed:

Jul. 11, 2003
Applicants:

Jifa Hao, Mountaintop, PA (US);

Rodney S. Ridley, Mountaintop, PA (US);

Gary M. Dolny, Mountaintop, PA (US);

Inventors:

Jifa Hao, Mountaintop, PA (US);

Rodney S. Ridley, Mountaintop, PA (US);

Gary M. Dolny, Mountaintop, PA (US);

Assignee:

Fairchild Semiconductor Corporation, South Portland, ME (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/94 (2006.01);
U.S. Cl.
CPC ...
Abstract

A power MOSFEThas a source metalthat contacts silicided source regionsthrough viasetched in an insulating layer. The silicide layerprovides for a relatively small but highly conductive contact and thus reduces RDSON. The insulating material may be any suitable material including and not limited to one or a combination of materials such as BPSG, PSG, silicon dioxide and silicon nitride. The insulating layer is relatively thin and does not extend deeply into the gate trench.


Find Patent Forward Citations

Hao, Jifa. (2008). Dense trench mosfet with decreased etch sensitivity to deposition and etch processing (U.S. Patent No. 7436021). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7436021

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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