The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2008

Filed:

Jun. 30, 2005
Applicants:

Kisho Ashida, Hitachinaka, JP;

Akira Muto, Haruna, JP;

Ichio Shimizu, Tamamura, JP;

Toshiyuki Hata, Maebashi, JP;

Kenya Kawano, Hitachinaka, JP;

Naotaka Tanaka, Kasumigaura, JP;

Nae Hisano, Matsudo, JP;

Inventors:

Kisho Ashida, Hitachinaka, JP;

Akira Muto, Haruna, JP;

Ichio Shimizu, Tamamura, JP;

Toshiyuki Hata, Maebashi, JP;

Kenya Kawano, Hitachinaka, JP;

Naotaka Tanaka, Kasumigaura, JP;

Nae Hisano, Matsudo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device has a semiconductor chip including first and second surfaces opposed to each other in a thickness direction of the semiconductor chip, wherein the first and second surfaces include first and second electrode surfaces respectively, and first and second electrically conductive members covering the first and second electrode surfaces respectively as seen in the thickness direction to be electrically connected to the first and second electrode surfaces respectively.


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