The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2008
Filed:
Mar. 16, 2004
Hsien-wei Chen, Xinying, TW;
Jiun-lin Yeh, Taipei, TW;
Shin-puu Jeng, Hsinchu, TW;
Yi-lung Cheng, Danshuei Township, Taipei County, TW;
Hsien-Wei Chen, Xinying, TW;
Jiun-Lin Yeh, Taipei, TW;
Shin-Puu Jeng, Hsinchu, TW;
Yi-Lung Cheng, Danshuei Township, Taipei County, TW;
Taiwan Semiconductor Manufacturing Company, Ltd, Hsin-Chu, TW;
Abstract
The present disclosure provides a method and system for heat dissipation in semiconductor devices. In one example, an integrated circuit semiconductor device includes a semiconductor substrate; one or more metallurgy layers connected to the semiconductor substrate, and each of the one or more metallurgy layers includes: one or more conductive lines; and one or more dummy structures between the one or more conductive lines and at least two of the one or more dummy structures are connected; and one or more dielectric layers between the one or more metallurgy layers.