The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2008
Filed:
Feb. 27, 2004
Michael Bauer, Regensburg, DE;
Peter Strobel, Regensburg, DE;
Gerald Ofner, Bad Abbach, DE;
Edward Fürgut, Dasing, DE;
Simon Jerebic, Regensburg, DE;
Thomas Bemmerl, Schwandorf, DE;
Markus Fink, Zell, DE;
Hermann Vilsmeier, Regensburg, DE;
Michael Bauer, Regensburg, DE;
Peter Strobel, Regensburg, DE;
Gerald Ofner, Bad Abbach, DE;
Edward Fürgut, Dasing, DE;
Simon Jerebic, Regensburg, DE;
Thomas Bemmerl, Schwandorf, DE;
Markus Fink, Zell, DE;
Hermann Vilsmeier, Regensburg, DE;
Infineon Technologies AG, Munich, DE;
Abstract
The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semiconductor chip separated from such a semiconductor wafer constitutes an electronic component with external contacts in the form of edge contacts. Such an electronic component of semiconductor chip size can be used in diverse ways.