The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2008

Filed:

Aug. 04, 2005
Applicants:

Masafumi Ito, Sennan-gun, Osaka, JP;

Yasuyuki Okamura, Santa, JP;

Tatsuo Shiina, Wakayama, JP;

Nobuo Ishii, Amagasaki, JP;

Tomohiro Suzuki, Nirasaki, JP;

Chishio Koshimizu, Nirasaki, JP;

Inventors:

Masafumi Ito, Sennan-gun, Osaka, JP;

Yasuyuki Okamura, Santa, JP;

Tatsuo Shiina, Wakayama, JP;

Nobuo Ishii, Amagasaki, JP;

Tomohiro Suzuki, Nirasaki, JP;

Chishio Koshimizu, Nirasaki, JP;

Assignees:

Other;

Tokyo Electron Limited, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 5/08 (2006.01); G01N 25/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The temperature of the surface and/or inside of a substrate is measured by irradiating the front surface or rear surface of the substrate, whose temperature is to be measured, with light and measuring the interference of a reflected light from the substrate and a reference light. A method and apparatus for measuring temperature or thickness which is suitable for directly measuring the temperature of the outermost surface layer of a substrate, and an apparatus for treating a substrate for an electronic device, which uses such method, are provided.


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