The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2008

Filed:

Sep. 09, 2004
Applicants:

Hung-en Tai, Taipei Hsien, TW;

Chia-yun Chen, Kao-Hsiung Hsien, TW;

Sheng-jen Wang, Hsin-Chu, TW;

Inventors:

Hung-En Tai, Taipei Hsien, TW;

Chia-Yun Chen, Kao-Hsiung Hsien, TW;

Sheng-Jen Wang, Hsin-Chu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of managing wafer defects includes inspecting each chip in a wafer to generate a unit of wafer defect raw data, using a server to integrate the unit of wafer defect raw data to generate a unit of wafer defect distribution data for recording positions, types, and sizes of defects, using the server to generate a corresponding drawing file according to the unit wafer defect distribution data to show all kinds of defect distributions, and transmitting the drawing file to a terminal such that terminal users can view the defect distributions without receiving the unit of wafer defect raw data.


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