The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2008
Filed:
Dec. 03, 2004
Syuudai Fukaya, Nanae, JP;
Toshiyuki Shinya, Hakodate, JP;
Hajime Hasebe, Hakodate, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A semiconductor device improved in packaging reliability is disclosed. Each of leads used in the semiconductor device has a first surface positioned between a main surface of a resin sealing body and a back surface opposite to the main surface of the resin sealing body, a second surface positioned on the side opposite to the first surface and exposed from the back surface of the resin sealing body, a first end face positioned on a semiconductor chip side, a second end face positioned on the side opposite to the first end face and exposed from a side face of the resin sealing body, and a recessed portion depressed from the second surface to the first surface side and contiguous to the second end face, the second surface and an inner wall surface of the recessed portion being covered with a plating layer which is higher in solder wettability than the second end face of each of the leads.