The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2008
Filed:
Apr. 24, 2003
Shen-nan Lee, Judung Jen, TW;
Ying-ho Chen, Taipei, TW;
Syun-ming Jang, Hsin-chu, TW;
Tzu-jen Chou, Hsinchu, TW;
Shen-Nan Lee, Judung Jen, TW;
Ying-Ho Chen, Taipei, TW;
Syun-Ming Jang, Hsin-chu, TW;
Tzu-Jen Chou, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd, Hsin-Chu, TW;
Abstract
A slurry system for a chemical mechanical polishing (CMP) process and a method for using the same wherein the slurry system includes an aqueous dispersion comprising at least abrasive polymer containing particles in an alkaline solution having a pH of less than about 9.5; and wherein the method includes providing a semiconductor wafer process surface including a oxide containing material and metal filled semiconductor features; providing the system; and, polishing in a CMP process the semiconductor wafer process surface using the slurry system to remove at least a portion of the oxide containing material and the metal comprising the metal filled semiconductor features.