The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2008
Filed:
Jun. 28, 2005
Applicants:
Leonel R. Arana, Phoenix, AZ (US);
Devendra Natekar, Chandler, AZ (US);
Michael Newman, Gilbert, AZ (US);
Charan K. Gurumurthy, Higley, AZ (US);
Inventors:
Leonel R. Arana, Phoenix, AZ (US);
Devendra Natekar, Chandler, AZ (US);
Michael Newman, Gilbert, AZ (US);
Charan K. Gurumurthy, Higley, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of forming a via having a stress buffer collar, wherein the stress buffer collar can absorb stress resulting from a mismatch in the coefficients of thermal expansion of the surrounding materials. Other embodiments are described and claimed.
Published as:
US2006290002A1; WO2007002870A1; TW200707645A; KR20080014095A; DE112006001588T5; CN101199049A; US7402515B2; US2008251932A1; JP2008545251A; HK1118956A1; KR20090115819A; KR100943306B1; CN101199049B; TWI336117B;