The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2008
Filed:
Mar. 03, 2006
Applicants:
Martin Standing, Tonbridge, GB;
Mark Pavier, Felbridge, GB;
Robert J. Clarke, Kent, GB;
Andrew Sawle, East Grinstead, GB;
Kenneth Mccartney, Tunbridge Wells, GB;
Inventors:
Martin Standing, Tonbridge, GB;
Mark Pavier, Felbridge, GB;
Robert J. Clarke, Kent, GB;
Andrew Sawle, East Grinstead, GB;
Kenneth McCartney, Tunbridge Wells, GB;
Assignee:
International Rectifier Corporation, El Segundo, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package fabrication method in which drop on demand deposition of a drop on demand depositable material is used to prepare one component or a plurality of components of a semiconductor package or multi-chip module.