The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2008
Filed:
Jun. 08, 2005
Applicants:
Toshiyuki Yoshikawa, Tokyo, JP;
Toshio Tsuchiya, Tokyo, JP;
Inventors:
Toshiyuki Yoshikawa, Tokyo, JP;
Toshio Tsuchiya, Tokyo, JP;
Assignee:
Disco Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/00 (2006.01); H01L 21/30 (2006.01); H01L 21/469 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wafer processing method for carrying out processing by applying a laser beam along streets formed on a wafer, comprising a step of applying a laser beam at an incident angle of a predetermined inclination angle to the normal line of a processing surface of the wafer while the wafer is processing-fed along a street from one end to the other end on the side of the laser beam application at an acute angle to the processing surface of the wafer.