The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2008
Filed:
Jun. 19, 2007
Shuji Ikeda, Koganei, JP;
Toshiaki Yamanaka, Menlo Park, CA (US);
Kenichi Kikushima, Ohme, JP;
Shinichiro Mitani, Tokorozawa, JP;
Kazushige Sato, Ohme, JP;
Akira Fukami, Higashimurayama, JP;
Masaya Iida, Yokohama, JP;
Akihiro Shimizu, Akishima, JP;
Shuji Ikeda, Koganei, JP;
Toshiaki Yamanaka, Menlo Park, CA (US);
Kenichi Kikushima, Ohme, JP;
Shinichiro Mitani, Tokorozawa, JP;
Kazushige Sato, Ohme, JP;
Akira Fukami, Higashimurayama, JP;
Masaya Iida, Yokohama, JP;
Akihiro Shimizu, Akishima, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A SRAM of complete CMOS type having its memory cell composed of six MISFETs, in which a pair of local wiring lines for connecting the input/output terminals of CMOS inverters are formed of a refractory metal silicide layer formed over a first conducting layer constituting the individual gate electrodes of the drive MISFETs, the transfer MISFETs and the load MISFETs of the memory cell and in which a reference voltage line formed over the local wiring lines is arranged to be superposed over the local wiring lines to form a capacity element. Moreover, the capacity element is formed between the local wiring lines and the first conducting layer by superposing the local wiring lines over the first conducting layer. Moreover, the local wiring lines are formed by using resistance lowering means such as silicification. In addition, there are made common the means for lowering the resistance of the gate electrode of the transfer MISFETs and the means for forming the local wiring lines.