The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2008
Filed:
Feb. 10, 2006
Atsushi Kazama, Chiyoda, JP;
Akihiro Yaguchi, Iwama, JP;
Hideo Miura, Koshigaya, JP;
Asao Nishimura, Koganei, JP;
Atsushi Kazama, Chiyoda, JP;
Akihiro Yaguchi, Iwama, JP;
Hideo Miura, Koshigaya, JP;
Asao Nishimura, Koganei, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A multi-chip module has at least two semiconductor chips. Each of the semiconductor chips has chip electrodes of the semiconductor chip, electrically conductive interconnections for electrically connection with the chip electrodes, electrically conductive lands for electrically connection with the interconnections, external terminals placed on the lands, and a stress-relaxation layer intervening between the lands and the semiconductor chip. The semiconductor chips are placed on a mounting board via the external terminals. The distance between farthest ones of external terminal positioned at an outermost end portions of said second semiconductor chip is smaller than that of the first semiconductor chip.