The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2008
Filed:
May. 28, 2004
Steven D. Gardner, Westford, MA (US);
Elvino M. Da Silveira, North Andover, MA (US);
Griffith L. Resor, Iii, Acton, MA (US);
Steven D. Gardner, Westford, MA (US);
Elvino M. da Silveira, North Andover, MA (US);
Griffith L. Resor, III, Acton, MA (US);
Azores Corporation, Wilmington, MA (US);
Abstract
A machine and method for high speed production of circuit patterns on silicon wafers or similar substrates may be used for applications including printing Integrated Circuit (IC) packaging patterns onto wafers prior to separating IC chips. Projection camera(s) simultaneously project image(s) onto substrate(s) carried on an X, Y, θ stage. The projection camera(s) may include independent alignment systems, light sources, and control of focus, image placement, image size, and dose. In one embodiment, each camera includes a 6-axis reticle chuck that moves a reticle to correct image-to-substrate overlay errors. In-stage metrology sensors and machine software establish and maintain the correct relationship among the machine's coordinate systems. Thus, two or more projection cameras can print simultaneously even when substrates are slightly misplaced on the X, Y, θ stage.