The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2008
Filed:
Oct. 27, 2004
Applicants:
Kiyoshi Yokoyama, Kokubu, JP;
Naoko Itonaga, Kokubu, JP;
Inventors:
Kiyoshi Yokoyama, Kokubu, JP;
Naoko Itonaga, Kokubu, JP;
Assignee:
Kyocera Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/00 (2006.01); C04B 35/565 (2006.01); H01L 21/677 (2006.01); B05C 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A composite material according to the present invention, is composed of SiC, SiO, at least one out of Al and Si, with He leak rate of 1.3×10Pa·m/sec or below, thereby providing a composite material, which has a higher vacuum air-tightness, an excellent thermal conductivity, an adjustable coefficient of thermal expansion, small variation in strength and higher reliability, and a method for manufacturing the composite material, and a wafer holding member including the composite material.