The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2008
Filed:
Jul. 08, 2005
Applicants:
Andy Wei, Dresden, DE;
Thorsten Kammler, Ottendorf-Okrilla, DE;
Michael Raab, Radebeul, DE;
Manfred Horstmann, Duerrrhoehrsdorf-Dittersbach, DE;
Inventors:
Andy Wei, Dresden, DE;
Thorsten Kammler, Ottendorf-Okrilla, DE;
Michael Raab, Radebeul, DE;
Manfred Horstmann, Duerrrhoehrsdorf-Dittersbach, DE;
Assignee:
Advanced Micro Devices, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
By direct bonding of two crystalline semiconductor layers of different crystallographic orientation and/or material composition and/or internal strain, bulk-like hybrid substrates may be formed, thereby providing the potential for forming semiconductor devices in accordance with a single transistor architecture on the hybrid substrate.