The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 03, 2008

Filed:

Sep. 15, 2006
Applicants:

Ching-tai Cheng, Tu-Cheng, TW;

Nien-tien Cheng, Tu-Cheng, TW;

Inventors:

Ching-Tai Cheng, Tu-Cheng, TW;

Nien-Tien Cheng, Tu-Cheng, TW;

Assignee:

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/08 (2006.01); H05K 7/20 (2006.01); F28F 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A thermal interface material is for being applied to the contact surfaces to eliminate the air interstices between the heat dissipating apparatus and the electronic component in order to improve heat dissipation of the electronic component. The thermal interface material includes pentaerythritol oleate as base oil and fillers filled in the pentaerythritol oleate for improving the heat conductivity of the thermal interface material. The pentaerythritol oleate is used for holding the fillers therein and filling the air interstices to achieve an intimate contact between the heat dissipating apparatus and the electronic component. The fillers include aluminum powders, zinc oxide powders and zinc oxide nano-particles.


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