The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2008
Filed:
May. 09, 2005
Applicants:
Frank Seliger, Zeitz, DE;
Matthias Lehr, Dresden, DE;
Marcel Wieland, Radebeul, DE;
Lothar Mergili, Dresden, DE;
Frank Kuechenmeister, Dresden, DE;
Inventors:
Frank Seliger, Zeitz, DE;
Matthias Lehr, Dresden, DE;
Marcel Wieland, Radebeul, DE;
Lothar Mergili, Dresden, DE;
Frank Kuechenmeister, Dresden, DE;
Assignee:
Advanced Micro Devices, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
Abstract
In a method according to the present invention, a substrate thinning process is performed on a bumped substrate prior to the ultimate solder reflow process to heal bump defects caused by the substrate thinning process. Concurrently, the risk of substrate breakage is reduced compared to the prior art process since the number of process steps, requiring handling of thinned substrates, is reduced.